Cr1 / Die Prep - Process Tech-2

**Our vision is to transform how the world uses information to enrich life for all.
**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners.
The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.
We do it all while committing to integrity, sustainability, and giving back to our communities.
Because doing so can fuel the very innovation we are pursuing.JR21313 CR1 / Die Prep - Process Tech-2
- Require process knowledge in Wafer Thinning & Wafer Dicing process
- Experience in operate DISCO Grinder, Sawing & Laser Machine
- Assist Engineer in conducting experiments (DOE)
- Troubleshoot deviations using systematic troubleshooting techniques
- Verify correct process variables for production (i.e.
materials, machine set points, etc.)
- Monitor Process SPC and Cpk (Processs Capability)
- Assist Engineer in maintaining operation procedures/specification
- Mentor/ Coaching to enhanced Operator/Technician skills towards setup/simplified working procedure
- Solves problems of more complexity
- Integrates thorough technical knowledge
- Coordinate and conduct training/briefing for operational personnel, i.e.
PEM tech, Mfg POs, etc.
on product/process requirement, machine and operation procedures
**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.