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Package Reliability Engineer

Package Reliability Engineer
Company:

Micron Semiconductor Asia Operations Pte. Ltd


Place:

Jakarta


Job Function:

Engineering

Details of the offer

**Our vision is to transform how the world uses information to enrich life for all.**Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR20463 Package Reliability EngineerAs a GQ (Global Quality) Package Reliability Engineer in the DRAM/Emerging Memory Quality and Reliability Assurance team (DEMQRA) at Micron Technology Inc., you will be responsible for package quality and reliability for one of Micron's product lines. This responsibility includes coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced and providing recommendations on product release based on package reliability test results. You will also be expected to devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues. You will coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers), and prepare reports for discussion with stakeholders. Additional duties include providing support to internal and external customers for package-related quality and reliability issues, and customer requests.**Responsibilities and Tasks**Manage Regulation for New Product Qualifications- Coordinating package qualification efforts for new products and when new designs, materials, or processes are introduced- Provide holistic qualification plans for new developments- Provide recommendations on product release based on package reliability test resultsDesign and Implement Reliability Test Plans- Devise reliability test plans to assess risk associated with excursions, conversions, and reliability and qualification issues- Provide advice for proper screen method for quality concerned lots- Sustain proper monitoring methodology for qualityRegulate Root Cause and Corrective Action Plans- Lead 8D report processes- Coordinate root cause and corrective action efforts within the GQ department for package related qualification failures and RMAs (failures from customers)- Prepare reports for discussion with stakeholdersAct as a liaison for both Internal and External Customers- Evaluate whether internal and external customer requests are reasonable and acceptable for Micron quality policy- Provide technical support for package-related quality and reliability issues- Supply technical expertise for customer requestsIf Senior- Leading other engineers to achieve goals of team- Provide advice and guidance to other engineers, mentor, and develop talent**Education**RequiredBachelors Degree or equivalent experience- Engineering - Electronics- Engineering - Materials Science- Engineering - Mechanical- Related field of study**Experience**Required2+ years experience in any of the following:- Micro Electronic Packaging, Quality/Reliability Engineering, Failure AnalysisDesired10+ years experience in any of the following:- If Senior more than 10 years experience in Micro Electronic Packaging, Quality/Reliability Engineering, Failure Analysis**Qualifications**:- Thorough knowledge of semiconductor component package assembly processes and challenges- Knowledge of surface mount processes and challenges- Understanding of mechanical and material interaction effects on reliability of IC components and/or Printed Circuit Assemblies (PCB) assemblies- Good understanding of the effects thermomechanical, thermal, mechanical and hygroscopic swelling stresses on package reliability- A working knowledge of industry standard reliability test methods of package level and board level, acceleration models used for life predictions, and sampling statistics preferred- Must be self-motivated, able to work independently, and detail oriented- Strong analytical problem solving skills, excellent multi-tasking skills and the ability to interact easily with other groups- Good written and verbal communication skills in English and computer skills are necessary- Ability for other Asian languages, especially Chinese and Japanese, can be a plus- Working knowledge of the software systems employed in backend manufacturing- Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.)**About Micron Technology, Inc.**All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.


Source: Whatjobs_Ppc

Job Function:

Requirements

Package Reliability Engineer
Company:

Micron Semiconductor Asia Operations Pte. Ltd


Place:

Jakarta


Job Function:

Engineering

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